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US Patent 11760900 Condensation curable composition

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Antonio Chaves

Amy Hua McKinstry

Hao Shen

Monjit Phukan

Date of Patent

September 19, 2023

Patent Application Number

17512083

Date Filed

October 27, 2021

Patent Citations

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US Patent 10040924 Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus

Patent Primary Examiner

CPC Code

Patent abstract

A moisture-curable composition is shown and described herein. The moisture-curable composition comprises a moisture-curable resin and a moisture scavenger selected from a cyanoalkylalkoxysilane. The inclusion of the cyanoalkylalkoxysilane in the moisture-curable composition has been found to effectively scavenge moisture and control the rate of curing and viscosity increase in the composition.

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