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US Patent 11760900 Condensation curable composition
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Patent
Date Filed
October 27, 2021
Date of Patent
September 19, 2023
Patent Application Number
17512083
Patent Citations
US Patent 8138297 Moisture-curable silylated polymer possessing improved storage stability
US Patent 10100233 Pressure sensitive adhesives
US Patent 7569653 Sealant composition having reduced permeability to gas
US Patent 10040924 Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus
Patent Inventor Names
Antonio Chaves
Amy Hua McKinstry
Hao Shen
Monjit Phukan
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11760900
Patent Primary Examiner
Marc S. Zimmer
CPC Code
C08F 230/08
C08K 5/5475
C08G 65/336
C08G 18/837
C09D 133/04
C09D 171/02
C09D 175/04
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