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US Patent 11762200 Bonded optical devices

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 16, 2020
Date of Patent
September 19, 2023
Patent Application Number
17124408
Patent Citations
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US Patent 10475778 Optoelectronic component and method for producing an optoelectronic component
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US Patent 11176450 Three dimensional circuit implementing machine trained network
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11296044 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 7105980 Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
•••
Patent Citations Received
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US Patent 12068278 Processed stacked dies
0
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US Patent 11967575 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
0
Patent Inventor Names
Belgacem Haba
Rajesh Katkar
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11762200
Patent Primary Examiner
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Bao-Luan Q Le

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