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US Patent 11764055 Substrate processing method and substrate processing device
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Patent
Date Filed
March 21, 2017
Date of Patent
September 19, 2023
Patent Application Number
16081242
Patent Citations
US Patent 8070882 Method for the wet-chemical treatment of a semiconductor wafer
US Patent 7494549 Substrate treatment apparatus and substrate treatment method
US Patent 10854479 Substrate processing method and substrate processing device
US Patent 7378355 System and methods for polishing a wafer
US Patent 7416611 Process and apparatus for treating a workpiece with gases
Patent Inventor Names
Nobuyuki Shibayama
Hiromichi Kaba
Toru Edo
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11764055
Patent Primary Examiner
Duy-Vu N Deo
CPC Code
B08B 3/10
B08B 7/04
H01L 21/02057
H01L 21/0209
H01L 21/67028
H01L 21/67046
H01L 21/67051
H01L 21/68728
H01L 21/68792
B08B 3/08
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