US Patent 11764131 Semiconductor device and manufacturing method thereof

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Patent

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Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11764131

Patent Inventor Names

Koji Tsukagoshi

Date of Patent

September 19, 2023

Patent Application Number

17562965

Date Filed

December 27, 2021

Patent Citations

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US Patent 8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

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US Patent 10665533 Lead frame and semiconductor device

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US Patent 7170168 Flip-chip semiconductor package with lead frame and method for fabricating the same

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US Patent 7268415 Semiconductor device having post-mold nickel/palladium/gold plated leads

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US Patent 7358119 Thin array plastic package without die attach pad and process for fabricating the same

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US Patent 8129229 Method of manufacturing semiconductor package containing flip-chip arrangement

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Patent abstract

The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip

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US Patent 11764131 Semiconductor device and manufacturing method thereof

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