US Patent 11764131 Semiconductor device and manufacturing method thereof
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US Patent 11764131 Semiconductor device and manufacturing method thereof
Article
Patent abstract
The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chip
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Koji Tsukagoshi
Date of Patent
September 19, 2023
Patent Application Number
17562965
Date Filed
December 27, 2021
Patent Citations
Patent Primary Examiner
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