Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Markus Wimplinger
Date of Patent
September 19, 2023
Patent Application Number
16483077
Date Filed
March 2, 2017
Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.
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