US Patent 8042593 Semiconductor chip bonding apparatus

Patent 8042593 was granted and assigned to Samsung on October, 2011 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Samsung

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8042593

Patent Inventor Names

Jeong-Soon Cho0

Yong-Dae Ha0

Bum-Woo Lee0

Cheal-Sang Yoon0

Jae-Ryoung Lee0

Pil-June Kim0

Date of Patent

October 25, 2011

Patent Application Number

12174771

Date Filed

July 17, 2008

Patent Citations Received

‌

US Patent 11764198 Method and device for bonding of chips

Patent Primary Examiner

‌

James Sells

Patent abstract

A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.

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