US Patent 8042593 Semiconductor chip bonding apparatus
Patent 8042593 was granted and assigned to Samsung on October, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor chip bonding apparatus maintains a semiconductor chip in a parallel state with respect to a lead frame when applying a bonding load.
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Patent Citations Received
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Patent Inventor Names
Bum-Woo Lee0
Cheal-Sang Yoon0
Jae-Ryoung Lee0
Jeong-Soon Cho0
Pil-June Kim0
Yong-Dae Ha0
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US Patent 08042593 Semiconductor chip bonding apparatus US Patent 8042593 Semiconductor chip bonding apparatus
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Patent Number
08042593
Patent Number
8042593
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US Patent 08042593 Semiconductor chip bonding apparatus
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Is a
Current assignee
Patent jurisdiction
Patent number
08042593
Date of patent
October 25, 2011
Patent application number
12174771
Date Filed
July 17, 2008
Patent primary examiner
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