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US Patent 11764344 Package structure and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 22, 2021
Date of Patent
September 19, 2023
Patent Application Number
17209110
Patent Citations
‌
US Patent 8707554 Method of manufacturing multilayer wiring substrate
‌
US Patent 9559045 Package structure and method for manufacturing the same
‌
US Patent 9578750 Package carrier and manufacturing method thereof
‌
US Patent 9847244 Semiconductor device and method
‌
US Patent 10325855 Backside drill embedded die substrate
‌
US Patent 10535632 Semiconductor package structure and method of manufacturing the same
‌
US Patent 10586746 Semiconductor device and method
‌
US Patent 10840180 Production method for multilayer wiring board
‌
US Patent 10707178 Wiring substrate
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US Patent 11393745 Semiconductor packages with embedded interconnects
•••
Patent Inventor Names
Cheng-Ta Ko
Kai-Ming Yang
Pu-Ju Lin
Chi-Hai Kuo
Tzyy-Jang Tseng
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11764344
Patent Primary Examiner
‌
Vu A Vu
CPC Code
‌
H01L 23/3121
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H01L 23/5383
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H01L 23/5386
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H01L 33/54
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H01L 2221/6835
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H01L 2933/005
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H01L 2933/0066
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H01L 21/6835
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H01L 21/568
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H01L 21/565
•••
Industry
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