Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Pi-Te Pan0
Chang-Fu Chen0
Date of Patent
January 31, 2017
0Patent Application Number
147995930
Date Filed
July 15, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.
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