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US Patent 9559045 Package structure and method for manufacturing the same

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Edits on 6 Dec, 2023
"Add patent abstract"
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Golden AI
edited on 6 Dec, 2023
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Patent abstract

Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.

Edits on 30 Sep, 2023
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Golden AI
edited on 30 Sep, 2023
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Patent Inventor Names
Chang-Fu Chen0
Pi-Te Pan0
Edits on 20 Sep, 2023
"update inverses"
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Golden AI
edited on 20 Sep, 2023
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Patent Citations Received
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US Patent 11764344 Package structure and manufacturing method thereof
Edits on 24 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Golden AI
edited on 24 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=095590450
Edits on 19 May, 2023
"Remove leading 0 from patent number"
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edited on 19 May, 2023
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US Patent 09559045 Package structure and method for manufacturing the same US Patent 9559045 Package structure and method for manufacturing the same

Infobox
Patent Number
095590450
Patent Number
95590450
Edits on 24 Sep, 2022
"Entity importer update"
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Golden AI
edited on 24 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
095590450
Date of Patent
January 31, 2017
0
Patent Application Number
147995930
Date Filed
July 15, 2015
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=095590450
Patent Primary Examiner
‌
Chuong A Luu
0
Edits on 15 Jun, 2022
"Entity importer update"
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Golden AI
edited on 15 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=09559045
Edits on 10 Jan, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 10 Jan, 2022
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Infobox (+7 properties)
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 US Patent 09559045 Package structure and method for manufacturing the same

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
09559045
Date of patent
January 31, 2017
Patent application number
14799593
Date Filed
July 15, 2015
Patent primary examiner
‌
Chuong A Luu

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