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US Patent 11765839 Additive manufactured 3D electronic substrate

Patent 11765839 was granted and assigned to Schlumberger on September, 2023 by the United States Patent and Trademark Office.

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Patent abstract

A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.

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