US Patent 11765839 Additive manufactured 3D electronic substrate
Patent 11765839 was granted and assigned to Schlumberger on September, 2023 by the United States Patent and Trademark Office.
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US Patent 11765839 Additive manufactured 3D electronic substrate
Article
Patent abstract
A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lweness Mazari
Mark Kostinovsky
Steven O. Dunford
Date of Patent
September 19, 2023
Patent Application Number
16156750
Date Filed
October 10, 2018
Patent Citations
Patent Primary Examiner
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