Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuya Nakamura
Jun Yoshida
Date of Patent
October 3, 2023
Patent Application Number
18151552
Date Filed
January 9, 2023
Patent Citations
Patent Primary Examiner
Patent abstract
The heat-shrinkable film includes a block copolymer comprising a vinyl aromatic hydrocarbon-derived structural unit and a conjugated diene-derived structural unit as a main component.
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