US Patent 11773251 Resin composition, heat-shrinkable film, and container
Patent 11773251 was granted and assigned to Denka (company) on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11773251 Resin composition, heat-shrinkable film, and container
Article
Patent abstract
The heat-shrinkable film includes a block copolymer comprising a vinyl aromatic hydrocarbon-derived structural unit and a conjugated diene-derived structural unit as a main component.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jun Yoshida
Yuya Nakamura
Date of Patent
October 3, 2023
Patent Application Number
18151552
Date Filed
January 9, 2023
Patent Citations
Patent Primary Examiner
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