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US Patent 11774190 Pierced thermal interface constructions

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 14, 2020
Date of Patent
October 3, 2023
Patent Application Number
16847851
Patent Citations
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US Patent 10566313 Integrated circuit chip carrier with in-plane thermal conductance layer
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US Patent 10781349 Thermal interface material including crosslinker and multiple fillers
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US Patent 7200006 Compliant thermal interface for electronic equipment
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US Patent 7269015 Heat sink interface insert
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US Patent 7416789 Refractory metal substrate with improved thermal conductivity
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US Patent 7464462 Method of forming anisotropic heat spreading apparatus for semiconductor devices
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US Patent 7582403 Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
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US Patent 7755184 Liquid metal thermal interface material system
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US Patent 7875972 Semiconductor device assembly having a stress-relieving buffer layer
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US Patent 8389119 Composite thermal interface material including aligned nanofiber with low melting temperature binder
•••
Patent Inventor Names
Mark K. Hoffmeyer
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11774190
Patent Primary Examiner
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Claire E Rojohn, III
CPC Code
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F28F 3/042
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B23P 15/26

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