Patent 11775722 was granted and assigned to Efabless Corporation on October, 2023 by the United States Patent and Trademark Office.
Systems and methods for generating an integrated circuit (IC) chip design are described. One of the methods includes receiving, on a data sheet, by a server, electrical parameters of a system on chip (SoC) to be designed. The method further includes receiving physical parameters of the SoC on the data sheet, generating a first design of the SoC according to the electrical parameters and the physical parameters, and receiving test parameters for testing the first design. The method further includes testing, via a design verification tool, the first design by applying the test parameters to the first design, receiving a second design of a second SoC, and coupling the second design to the first design to generate a first IC chip design. The method includes arranging the first IC chip design to be included on a shuttle for fabricating a first IC chip.