US Patent 11776947 Electronic component and manufacturing method therefor
Patent 11776947 was granted and assigned to TDK on October, 2023 by the United States Patent and Trademark Office.
All edits
Edits on 5 Oct, 2023
Golden AI
Edits made to:
Infobox (+37 properties)
Article (+494 characters)
US Patent 11776947 Electronic component and manufacturing method therefor
Article
Patent abstract
Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenichi Yoshida
Takashi Ohtsuka
Tomoya Hanai
Yu Fukae
Yuichiro Okuyama
Yusuke Oba
Date of Patent
October 3, 2023
Patent Application Number
17206656
Date Filed
March 19, 2021
Patent Citations
Patent Primary Examiner
Find more entities like US Patent 11776947 Electronic component and manufacturing method therefor
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
