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US Patent 11776962 Method of manufacturing integrated circuit device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 7, 2022
Date of Patent
October 3, 2023
Patent Application Number
17715192
Patent Citations
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US Patent 9184090 Thin film transistor display panel and manufacturing method of the same
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US Patent 9466494 Selective growth for high-aspect ration metal fill
‌
US Patent 9812400 Contact line having insulating spacer therein and method of forming same
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US Patent 9875938 Integrated circuit device and method of fabricating the same
‌
US Patent 9905671 Forming a gate contact in the active area
‌
US Patent 9935168 Gate contact with vertical isolation from source-drain
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US Patent 10553582 Semiconductor device and method of manufacturing the same
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US Patent 10096688 Integrated circuit device and method of manufacturing the same
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US Patent 10763254 Semiconductor device
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US Patent 8969878 Semiconductor device and method for manufacturing the device
•••
Patent Inventor Names
Seung-ho Chae
Ha-young Choi
Heung-sik Park
Hong-sik Shin
In-keun Lee
Do-haing Lee
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11776962
Patent Primary Examiner
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Changhyun Yi
CPC Code
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H01L 27/0924
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H01L 21/823821
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H01L 21/823468
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H01L 29/785
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H01L 29/66795
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H01L 21/823431

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