US Patent 11778775 Cooling device and method of manufacturing the same

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.