Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hai-Dang Trinh
Cheng-Yuan Tsai
Shing-Chyang Pan
Albert Zhong
Date of Patent
October 3, 2023
Patent Application Number
17868824
Date Filed
July 20, 2022
Patent Citations
Patent Primary Examiner
Patent abstract
Some embodiments relate to a method for forming an integrated chip. The method includes forming a bottom electrode over a substrate. A data storage layer is formed on the bottom electrode. A diffusion barrier layer is formed over the data storage layer. The diffusion barrier layer has a first diffusion activation temperature. A top electrode is formed over the diffusion barrier layer. The top electrode has a second diffusion activation temperature less than the first diffusion activation temperature.
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