Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tomoaki Ishibashi
Hiroki Kon
Date of Patent
October 10, 2023
Patent Application Number
16473346
Date Filed
December 22, 2017
Patent Citations
Patent Primary Examiner
Patent abstract
Solutions are disclosed for preventing the settling of an abrasive, while maintaining the polishing performance of a polishing composition. Solutions are disclosed for improving the redispersibility of an abrasive while maintaining the polishing performance. Polishing compositions for use in polishing a semiconductor substrate according to the present disclosure include an abrasive, a layered compound, and a dispersion medium.
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