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US Patent 11784033 Methods and apparatus for processing a substrate

Patent 11784033 was granted and assigned to Applied Materials on October, 2023 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
May 28, 2021
Date of Patent
October 10, 2023
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
17333732
Patent Citations
‌
US Patent 10157733 Methods for igniting a plasma in a substrate processing chamber
‌
US Patent 7112960 Eddy current system for in-situ profile measurement
‌
US Patent 7935232 Sputtering apparatus and method, and sputtering control program
‌
US Patent 8227344 Hybrid in-situ dry cleaning of oxidized surface layers
‌
US Patent 8643454 Field emission system and method
‌
US Patent 10312065 Physical vapor deposition (PVD) plasma energy control per dynamic magnetron control
Patent Inventor Names
Jiao Song
Palaniappan Chidambaram
Mengxue Wu
Jay Min Soh
Chul Nyoung Lee
Siew Kit Hoi
Yue Cui
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11784033
Patent Primary Examiner
‌
Michael A Band
CPC Code
‌
C23C 14/3492
‌
C23C 14/54
‌
C23C 14/3485
‌
C23C 14/345
‌
C23C 14/35
‌
H01J 37/3467
‌
H01J 37/3464
‌
H01J 37/3455
‌
H01J 37/3476

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