US Patent 11784108 Thermal management in integrated circuit packages
Patent 11784108 was granted and assigned to Intel on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11784108 Thermal management in integrated circuit packages
Article
Patent abstract
Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Aleksandar Aleksov
Feras Eid
Georgios Dogiamis
Johanna M. Swan
Telesphor Kamgaing
Date of Patent
October 10, 2023
Patent Application Number
16533152
Date Filed
August 6, 2019
Patent Citations
Patent Primary Examiner
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