Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Richard Farrington Vreeland
Sansaptak Dasgupta
Nicholas James Harold McKubre
Kevin L. Lin
Date of Patent
October 10, 2023
Patent Application Number
17700198
Date Filed
March 21, 2022
Patent Primary Examiner
Patent abstract
Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
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