US Patent 11784121 Integrated circuit components with dummy structures
Patent 11784121 was granted and assigned to Intel on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11784121 Integrated circuit components with dummy structures
Article
Patent abstract
Disclosed herein are integrated circuit (IC) components with dummy structures, as well as related methods and devices. For example, in some embodiments, an IC component may include a dummy structure in a metallization stack. The dummy structure may include a dummy material having a higher Young's modulus than an interlayer dielectric of the metallization stack.
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Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kevin L. Lin
Nicholas James Harold McKubre
Richard Farrington Vreeland
Sansaptak Dasgupta
Date of Patent
October 10, 2023
Patent Application Number
17700198
Date Filed
March 21, 2022
Patent Primary Examiner
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