US Patent 11787690 MEMS assembly substrates including a bond layer
Patent 11787690 was granted and assigned to Knowles (company) on October, 2023 by the United States Patent and Trademark Office.
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US Patent 11787690 MEMS assembly substrates including a bond layer
Article
Patent abstract
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
John Szczech
Josh Watson
Sung Bok Lee
Date of Patent
October 17, 2023
Patent Application Number
17221479
Date Filed
April 2, 2021
Patent Citations
Patent Primary Examiner
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