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US Patent 11791242 Semiconductor device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 9, 2021
Date of Patent
October 17, 2023
Patent Application Number
17371602
Patent Citations
‌
US Patent 9679850 Method of fabricating semiconductor structure
‌
US Patent 9865549 Semiconductor device, manufacturing method thereof, and electronic apparatus
‌
US Patent 9997393 Methods for fabricating integrated circuits including substrate contacts
‌
US Patent 10535631 3D Chip-on-wager-on-substrate structure with via last process
‌
US Patent 10269863 Methods and apparatus for via last through-vias
‌
US Patent 10600759 Power and ground design for through-silicon via structure
‌
US Patent 9536777 Interconnect apparatus and method
‌
US Patent 9666520 3D stacked-chip package
Patent Inventor Names
Kwangwuk Park
Inyoung Lee
Sungdong Cho
Hyoungyol Mun
Youngmin Lee
Seokhwan Jeong
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11791242
Patent Primary Examiner
‌
Herve-Louis Y Assouman
CPC Code
‌
H01L 2225/06586
‌
H01L 24/05
‌
H01L 24/13
‌
H01L 2225/06517
‌
H01L 2225/06541
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H01L 2225/06562
‌
H01L 23/49827
‌
H01L 23/485
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H01L 23/49838
‌
H01L 24/06
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