Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuo-Hua Pan
Wen-Che Tsai
Hua Feng Chen
Min-Yann Hsieh
Date of Patent
October 31, 2023
Patent Application Number
17136385
Date Filed
December 29, 2020
Patent Citations
...
Patent Primary Examiner
Patent abstract
The present disclosure provides an integrated circuit (IC) structure. The IC structure includes first and second fins formed on a semiconductor substrate and laterally separated from each other by an isolation feature, the isolation feature formed of a dielectric material that physically contacts the semiconductor substrate; and a contact feature between the first and second fins and extending into the isolation feature thereby defining an air gap vertically between the isolation feature and the contact feature, the dielectric material of the isolation feature extending from the semiconductor substrate to the contact feature.
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