Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng-Chieh Hsieh
Shin-Puu Jeng
Hsien-Wei Chen
Chen-Hua Yu
Der-Chyang Yeh
Ming-Yen Chiu
Date of Patent
October 31, 2023
Patent Application Number
18175189
Date Filed
February 27, 2023
Patent Citations
...
Patent Primary Examiner
Patent abstract
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using materials that are different than the first external connections in order to provide a thermal pathway from the first package. In a particular embodiment the first external connections are solder balls and the second external connections are copper blocks.
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