Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Da Cheng0
Wen-Hsiung Lu0
Chih-Wei Lin0
Chung-Shi Liu0
Kuei-Wei Huang0
Meng-Tse Chen0
Date of Patent
March 10, 2015
Patent Application Number
13275065
Date Filed
October 17, 2011
Patent Citations Received
Patent Primary Examiner
Patent abstract
A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.
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