Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenji Sugakawa0
Yosuke Omori0
Date of Patent
December 5, 2023
0Patent Application Number
173203380
Date Filed
May 14, 2021
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
