US Patent 11837574 Bonding apparatus and bonding method
Patent 11837574 was granted and assigned to Tokyo Electron on December, 2023 by the United States Patent and Trademark Office.
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US Patent 11837574 Bonding apparatus and bonding method
Article
Patent abstract
A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenji Sugakawa0
Yosuke Omori0
Date of Patent
December 5, 2023
0Patent Application Number
173203380
Date Filed
May 14, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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