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US Patent 11844193 Direct contact fluid based cooling module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 24, 2021
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Date of Patent
December 12, 2023
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Patent Application Number
17534900
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Patent Citations
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US Patent 7992627 Microjet module assembly
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US Patent 9653378 Heat dissipation solution for advanced chip packages
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US Patent 9750159 Pump-enhanced, immersion-cooling of electronic compnent(s)
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US Patent 9852963 Microprocessor assembly adapted for fluid cooling
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US Patent 9901008 Redundant heat sink module
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US Patent 9903664 Jet impingement cooling apparatuses having non-uniform jet orifice sizes
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US Patent 10152096 Cooling liquid distribution device
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US Patent 10228735 Methods of direct cooling of packaged devices and structures formed thereby
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US Patent 10270220 Methods and systems for heat flux heat removal
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US Patent 10285309 Submerged datacenter
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•••
Patent Inventor Names
Bernard Malouin
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Jordan Mizerak
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11844193
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Patent Primary Examiner
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Adam B Dravininkas
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CPC Code
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H01L 23/473
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H01L 23/4735
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H01L 23/467
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H01L 23/4006
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H05K 7/20772
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H05K 7/20254
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H05K 7/20272
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H05K 7/20345
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H05K 7/20927
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H05K 7/20736
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•••

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