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US Patent 11854835 Heterogeneous bonding structure and method forming same
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Patent
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Date Filed
August 10, 2022
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Date of Patent
December 26, 2023
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Patent Application Number
17818747
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Patent Citations
US Patent 8809123 Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
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US Patent 10854574 Forming metal bonds with recesses
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US Patent 7897431 Stacked semiconductor device and method
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US Patent 10790262 Low temperature bonded structures
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Patent Inventor Names
Mirng-Ji Lii
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Ming-Da Cheng
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Wen-Hsiung Lu
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Chen-Shien Chen
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Lung-Kai Mao
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11854835
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Patent Primary Examiner
Selim U Ahmed
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