Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ying-Ching Shih0
Chen-Hua Yu0
Pu Wang0
Jing-Cheng Lin0
Date of Patent
December 26, 2023
0Patent Application Number
172154930
Date Filed
March 29, 2021
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.
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