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US Patent 11854879 Cu

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Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

118548790

Patent Inventor Names

Faye Walker0

John J. Drab0

Andrew Clarke0

Date of Patent

December 26, 2023

Patent Application Number

171847560

Date Filed

February 25, 2021

Patent Citations

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US Patent 8709938 3D IC method and device

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US Patent 6902987 Method for low temperature bonding and bonded structure

Patent Primary Examiner

CPC Code

...

Patent abstract

A Cu

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