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US Patent 11854879 Cu
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Edits on 27 Dec, 2023
"Created via: Patent importer"
Golden AI
created this topic on 27 Dec, 2023
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US Patent 11854879 Cu
Article
Patent abstract
A Cu
Infobox
Is a
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11854879
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Patent Inventor Names
Andrew Clarke
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Faye Walker
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John J. Drab
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Date of Patent
December 26, 2023
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Patent Application Number
17184756
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Date Filed
February 25, 2021
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Patent Citations
US Patent 8709938 3D IC method and device
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US Patent 6902987 Method for low temperature bonding and bonded structure
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Patent Primary Examiner
Thanh T Nguyen
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CPC Code
H01L 2924/00015
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H01L 2924/10379
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H01L 2224/08145
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H01L 2224/04
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H01L 2224/06181
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H01L 2224/05688
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H01L 2224/05687
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H01L 2224/05647
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H01L 2224/05576
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H01L 2224/05568
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H01L 24/80
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H01L 24/09
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H01L 24/08
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H01L 24/06
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H01L 24/05
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H01L 24/03
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H01L 23/53233
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H01L 23/528
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H01L 23/5226
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H01L 2224/80905
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H01L 2224/80906
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H01L 2224/80896
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H01L 2224/80895
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H01L 2224/8083
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H01L 2224/80203
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H01L 2224/80204
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H01L 2224/80013
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H01L 2224/05111
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H01L 2224/0508
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H01L 2224/05082
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H01L 2224/05073
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H01L 2224/05027
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H01L 2224/039
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H01L 2224/03848
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H01L 2224/03845
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H01L 2224/03622
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H01L 2224/0361
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H01L 2224/03464
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H01L 2224/03462
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H01L 2224/03452
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H01L 2224/0345
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H01L 2224/03416
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H01L 21/76886
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H01L 21/76883
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H01L 21/76873
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H01L 21/76864
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H01L 21/76858
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H01L 21/76843
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H01L 21/76802
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H01L 2224/09181
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H01L 2924/3656
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