Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
KyoungHee Park0
OMin Kwon0
JiWon Lee0
YuJeong Jang0
ChangOh Kim0
JinHee Jung0
Date of Patent
January 2, 2024
0Patent Application Number
178069240
Date Filed
June 14, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.
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