Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsin-Chin Chang0
Jen-Chun Chen0
Date of Patent
May 3, 2016
0Patent Application Number
137457660
Date Filed
January 19, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
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