Patent 11867754 was granted and assigned to Cornell University Press on January, 2024 by the United States Patent and Trademark Office.
A system, comprising: (i) an interposer layer; (ii) a circuit layer positioned on the interposer layer and comprising a plurality of sonically-enabled pads; and (iii) an interrogator layer positioned on the circuit layer and comprising a plurality of ultrasonic transducers configured to sonically interrogate the circuit layer; wherein the sonically-enabled pads are configured to generate an electrical signal in response to sonic interrogation from the interrogator layer, if the sonically-enabled pad is functional.