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US Patent 11873428 Thermosetting adhesive films

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
November 13, 2019
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Date of Patent
January 16, 2024
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Patent Application Number
16682516
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Patent Citations
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US Patent 7008680 Heat-activatable adhesive
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US Patent 6887914 Structural hot melt material and methods
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US Patent 6890964 Homopolymerized epoxy-based form-in-place material
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US Patent 6894082 Foamable compositions
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US Patent 6911109 Two-part, room temperature curable epoxy resin/ (meth)acrylate compositions and process for using same to bond substrates
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US Patent 6920693 Dynamic self-adjusting assembly for sealing, baffling or structural reinforcement
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US Patent 6955593 HVAC protection system for automotive vehicles
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US Patent 6991237 Paintable seal system
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US Patent 7025409 Automotive rail/frame energy management system
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US Patent 7071263 Epoxy adhesives and bonded substrates
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•••
Patent Inventor Names
Michel Awkal
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Ira Miller
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Michael Czaplicki
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11873428
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Patent Primary Examiner
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John D Freeman
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CPC Code
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C09J 7/35
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C09J 163/00
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C09J 171/00
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C09J 2301/122
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C09J 2301/124
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C09J 2301/414
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C09J 2451/00
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C09J 2461/00
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C09J 2463/00
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C09J 2463/006
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•••

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