Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming Cheng0
Ying-Yuh Lu0
Date of Patent
July 4, 2006
0Patent Application Number
104405910
Date Filed
May 19, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
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