US Patent 7071263 Epoxy adhesives and bonded substrates
Patent 7071263 was granted and assigned to 3M on July, 2006 by the United States Patent and Trademark Office.
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Patent abstract
Epoxy adhesives are reported that comprise: (i) about 20% to about 40% weight of a reactive oligomer having a glass transition temperature of about −40° C. or less after curing and having at least two functional groups selected from epoxide, isocyanate, and amine; (ii) an amine curative; and (iii) an epoxide-group containing compound. The epoxy adhesives are resistant to thermal shock and have a low shear creep. The epoxy adhesives are particularly suitable for bonding substrates having mismatched coefficients of thermal expansion.
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Patent Inventor Names
Ming Cheng0
Ying-Yuh Lu0
Date of Patent
July 4, 2006
0Patent Application Number
104405910
Date Filed
May 19, 2003
0Patent Primary Examiner
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US Patent 7071263 Epoxy adhesives and bonded substrates
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