US Patent 7071263 Epoxy adhesives and bonded substrates
Patent 7071263 was granted and assigned to 3M on July, 2006 by the United States Patent and Trademark Office.
Is a
Current Assignee
0
Date Filed
May 19, 2003
0
Date of Patent
July 4, 2006
0
Patent Application Number
10440591
0
Patent Citations Received
Patent Inventor Names
Ming Cheng
0
Ying-Yuh Lu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 7071263 Epoxy adhesives and bonded substrates
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
