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US Patent 11877382 Immersion cooling system in miniaturized form
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Patent
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Date Filed
August 22, 2022
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Date of Patent
January 16, 2024
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Patent Application Number
17892280
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Patent Citations
US Patent 7414845 Circuit board assembly for a liquid submersion cooled electronic device
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US Patent 11032939 Liquid submersion cooled electronic systems
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US Patent 6979772 Integrated heat dissipating enclosure for electronic product
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US Patent 8035964 Multi-position housing made of metal extruded section member for manufacturing a waterproof power electronic device
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Patent Inventor Names
Jia-Hong Wu
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Hsin-Ting Lin
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Li-Wen Guo
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11877382
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Patent Primary Examiner
Abhishek M Rathod
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CPC Code
H05K 7/20281
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H05K 7/20409
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H05K 7/20772
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H05K 5/067
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H05K 7/1461
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H05K 7/20154
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H05K 7/20909
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H05K 7/20918
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F28F 27/00
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G06F 1/20
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