US Patent 11877390 Fabricating tamper-respondent sensors with random three-dimensional security patterns

Methods of fabricating tamper-respondent sensors with random three-dimensional security patterns are provided. The methods include establishing a security circuit pattern for a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components of a circuit board within a secure volume. The establishing includes determining in three-dimensions boundaries for the security circuit of the tamper-respondent sensor. The boundaries define a sensor volume which the security circuit is to fill in three dimensions. The establishing also includes generating at least one trace configuration for the security circuit pattern. The at least one trace configuration defines a random, three-dimensional security pattern to fill the sensor volume, and the at least one trace configuration establishes, at least in part, the security circuit pattern. The process further includes fabricating the tamper-respondent sensor based on the established security circuit pattern.