US Patent 11889634 Printed circuit board and method of manufacturing the same
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US Patent 11889634 Printed circuit board and method of manufacturing the same
Article
Patent abstract
A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
Infobox
Is a
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dae Young Choi0
Dong Hun Jeong0
Han Su Lee0
In Ho Jeong0
Jae Hoon Jeon0
Jin Hak Lee0
Jung Ho Hwang0
Kil Dong Son0
Sang Hwa Kim0
Sang Young Lee0
Soon Gyu Kwon0
Yun Mi Bae0
Date of Patent
January 30, 2024
0Patent Application Number
171352230
Date Filed
December 28, 2020
0Patent Citations
Patent Primary Examiner
CPC Code
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