Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 23, 2013
Patent Application Number
12765250
Date Filed
April 22, 2010
Patent Citations Received
Patent Primary Examiner
Patent abstract
A copper pillar bump has a sidewall protection layer formed of an electrolytic metal layer. The electrolytic metal layer is an electrolytic nickel layer, an electrolytic gold layer, and electrolytic copper layer, or an electrolytic silver layer.
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